Fatigue life prediction of solder joints in electronic packages with ANSYS /

Bibliographic Details
Main Author:	Madenci, Erdogan
Other Authors:	Guven, Ibrahim, Kilic, Bahattin
Format:	Book
Language:	English
Published:	Boston : Kluwer Academic Publishers, [2003]
Series:	Kluwer international series in engineering and computer science ; SECS 719.
Subjects:	Electronic packaging > Computer-aided design. Solder and soldering > Quality control. Metals > Fatigue. Service life (Engineering) > Forecasting. ANSYS (Computer system)

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