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Fatigue life prediction of solder joints in electronic packages with ANSYS /

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Bibliographic Details
Main Author: Madenci, Erdogan
Other Authors: Guven, Ibrahim, Kilic, Bahattin
Format: Book
Language:English
Published: Boston : Kluwer Academic Publishers, [2003]
Series:Kluwer international series in engineering and computer science ; SECS 719.
Subjects:
Electronic packaging > Computer-aided design.
Solder and soldering > Quality control.
Metals > Fatigue.
Service life (Engineering) > Forecasting.
ANSYS (Computer system)
Description
Item Description:Includes bibliographical references and index.
Physical Description:xx, 185 pages : illustrations ; 25 cm. + 1 CD-ROM (4 3/4 in.).
ISBN:1402073305 (alk. paper)