Improving the reliability of microelectronic packaging through core-shell rubber technology /

The field of microelectronics is currently in high demand considering the many applications it is used for. With this demand, several concerns are raised to improve the reliability while in use. The microelectronic device is composed of numerous components, many times joined together by an epoxy-b...

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Bibliographic Details

Main Author:	Weaver, Jana Lynn
Format:	Thesis eBook
Language:	English
Published:	[Place of publication not identified] : [publisher not identified] ; 2001.
Subjects:	Major mechanical engineering.
Online Access:	Link to OAKTrust copy