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Proceedings /

Bibliographic Details
Corporate Authors: International Symposium for Testing and Failure Analysis, Microelectronics Symposium, Advanced Materials Symposium
Format: Conference Proceeding
Language:English
Published: Metals Park, Ohio : ASM International.
Subjects:
Electronics > Materials > Testing > Congresses.
Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
Semiconductors > Testing > Congresses.
Online Availability: Check for online availability
Description
Published:Began with: 1980.
Item Description:Description based on: 1986.
Issue for 1987 published in 2 volumes called also: Proceedings of the Microelectronics Symposium, and: Proceedings of the Advanced Materials Symposium.
Volumes for 1987-<1992> have cover title: Proceedings of the ... International Symposium for Testing and Failure Analysis.
Volumes for <1996- > have cover title: Conference proceedings.
Physical Description:volumes : illustrations ; 28 cm.
Issued also 1999- on CD-ROM as: Conference proceedings from the ... International Symposium for Testing and Failure Analysis.
Publication Frequency:Annual
ISSN:0890-1740