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Proceedings /

Bibliographic Details
Corporate Authors: International Symposium for Testing and Failure Analysis, Microelectronics Symposium, Advanced Materials Symposium
Format: Conference Proceeding
Language:English
Published: Metals Park, Ohio : ASM International.
Subjects:
Electronics > Materials > Testing > Congresses.
Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
Semiconductors > Testing > Congresses.
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Holdings details from Remote Storage
Call Number: TK7871 .I59a
Library Owns: TK7871 .I59a (1986,; 1993,; 1997-2003; 30th-32nd (2004-2006))
Call Number Status Get It
TK7871 .I59a 23rd 1997 Available
TK7871 .I59a 30th 2004 Available
TK7871 .I59a 32nd 2006 Available
TK7871 .I59a 1986 Available
TK7871 .I59a 1993 Available
TK7871 .I59a 1998 Available
TK7871 .I59a 1999 Available
TK7871 .I59a 2000 Available
TK7871 .I59a 2001 Available
TK7871 .I59a 2002 Available
TK7871 .I59a 2003 Available
TK7871 .I59a 2005 Available