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Materials for high-density electronic packaging and interconnection.

Bibliographic Details
Corporate Authors: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging, NetLibrary, Inc
Format: eBook
Language:English
Published: Washington, D.C. : National Academy Press, 1990.
Subjects:
Electronic packaging > Materials.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Available from Defense Technical Information Center, Cameron Station.
"NMAB-449."
Electronic resource.
Physical Description:xiv, 139 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references.
ISBN:0585143951 (electronic bk.) :