Materials for high-density electronic packaging and interconnection.

Bibliographic Details
Corporate Authors:	National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging, NetLibrary, Inc
Format:	eBook
Language:	English
Published:	Washington, D.C. : National Academy Press, 1990.
Subjects:	Electronic packaging > Materials. Electronic books.
Online Access:	Connect to the full text of this electronic book

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