Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies /

Bibliographic Details
Main Author:	Lee, Ning-Cheng
Format:	Book
Language:	English
Published:	Boston : Newnes, [2002]
Subjects:	Electronic apparatus and appliances > Design and construction. Solder and soldering. Electronic packaging. Electric connectors.

Remote Storage