Cover Image

Thermal conductivity 25 : thermal expansion 13 : joint conferences, June 13-16, 1999, Ann Arbor, Michigan, USA /

Bibliographic Details
Corporate Authors: International Thermal Conductivity Conference, International Thermal Expansion Symposium
Other Authors: Uher, Ctirad, Morelli, Donald
Format: Conference Proceeding Book
Language:English
Published: Lancaster, Pa. : Technomic Pub. Co., [2000]
Subjects:
Heat > Conduction > Congresses.
Materials > Thermal properties > Congresses.
Expansion (Heat) > Congresses.
Description
Physical Description:xiv, 391 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and indexes.
ISBN:1566768063