Thermal conductivity 25 : thermal expansion 13 : joint conferences, June 13-16, 1999, Ann Arbor, Michigan, USA /

Bibliographic Details
Corporate Authors:	International Thermal Conductivity Conference, International Thermal Expansion Symposium
Other Authors:	Uher, Ctirad, Morelli, Donald
Format:	Conference Proceeding Book
Language:	English
Published:	Lancaster, Pa. : Technomic Pub. Co., [2000]
Subjects:	Heat > Conduction > Congresses. Materials > Thermal properties > Congresses. Expansion (Heat) > Congresses.

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