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Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California /

Bibliographic Details
Corporate Authors: HD International Conference on High-Density Interconnect and Systems Packaging Santa Clara, Calif., International Microelectronics and Packaging Society, CMP Media, Society of Photo-optical Instrumentation Engineers
Format: Conference Proceeding Book
Language:English
Published: Washington, D.C. : [Bellingham, Wash.] : IMAPS ; Published in cooperation with SPIE, [2001]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 4428.
Subjects:
Microelectronic packaging > Congresses.
Integrated circuits > Design and construction > Congresses.
Microelectromechanical systems > Congresses.
Description
Physical Description:x, 380 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0930815637