Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California /

Bibliographic Details
Corporate Authors:	HD International Conference on High-Density Interconnect and Systems Packaging Santa Clara, Calif., International Microelectronics and Packaging Society, CMP Media, Society of Photo-optical Instrumentation Engineers
Format:	Conference Proceeding Book
Language:	English
Published:	Washington, D.C. : [Bellingham, Wash.] : IMAPS ; Published in cooperation with SPIE, [2001]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 4428.
Subjects:	Microelectronic packaging > Congresses. Integrated circuits > Design and construction > Congresses. Microelectromechanical systems > Congresses.

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