Microvias : for low cost, high density interconnects /

Bibliographic Details
Main Author:	Lau, John H.
Other Authors:	Lee, S. W. Ricky
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, [2001]
Series:	McGraw-Hill professional engineering.
Subjects:	Microelectronic packaging. Integrated circuits > Design and construction > Cost control. Semiconductors > Junctions. Printed circuits.

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