2000 HD International Conference on High-Density Interconnect and Systems Packaging : 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA /

Bibliographic Details
Corporate Authors:	HD International Conference on High-Density Interconnect and Systems Packaging Denver, Colo., International Microelectronics and Packaging Society, Society of Photo-optical Instrumentation Engineers, CMP Media
Format:	Conference Proceeding Book
Language:	English
Published:	Reston, VA : [Bellingham, Wash.] : IMAPS ; Published in cooperation with SPIE--the International Society for Optical Engineering, [2000]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 4217.
Subjects:	Microelectronic packaging > Congresses. Integrated circuits > Design and construction > Congresses. Microelectromechanical systems > Congresses.

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