Benefiting from thermal and mechanical simulation in micro-electronics /

Bibliographic Details
Corporate Author:	EuroSimE 2000 Eindhoven, Netherlands
Other Authors:	Ernst, L. J., Zhang, G. Q., Saint Leger, O. de
Format:	Conference Proceeding Book
Language:	English
Published:	Boston : Kluwer Academic Publishers, [2000]
Subjects:	Microelectronics > Design. Microelectronics > Simulation methods. Micromechanics.

Remote Storage