Copper interconnect technology /

Bibliographic Details
Main Author:	Steinbruchel, Christoph
Other Authors:	Chin, Barry Lee
Format:	Book
Language:	English
Published:	Bellingham, Wash. : SPIE Press, [2001]
Series:	Tutorial texts in optical engineering ; v. TT46.
Subjects:	Electronic packaging. Semiconductors > Junctions. Microelectronic packaging. Copper.

Description
Physical Description:	viii, 122 pages : illustrations ; 26 cm.
Bibliography:	Includes bibliographical references (pages 103-117) and index.
ISBN:	0819438979 (softcover)