Copper interconnect technology /

Bibliographic Details
Main Author:	Steinbruchel, Christoph
Other Authors:	Chin, Barry Lee
Format:	Book
Language:	English
Published:	Bellingham, Wash. : SPIE Press, [2001]
Series:	Tutorial texts in optical engineering ; v. TT46.
Subjects:	Electronic packaging. Semiconductors > Junctions. Microelectronic packaging. Copper.

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