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Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition, Symposium on Mechanics of SMT and Photonic Structures
Other Authors: Kowalski, G. J. (Gregory Joseph)
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [2000]
Series:EEP (Series) ; vol. 28.
Subjects:
Electronic packaging > Congresses.
Surface mount technology > Congresses.
Solder and soldering > Congresses.
Semiconductor wafers > Design and manufacture > Congresses.
Photonics > Congresses.
Description
Physical Description:vi, 299 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and author index.
ISBN:0791819302