Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition, Symposium on Mechanics of SMT and Photonic Structures
Other Authors:	Kowalski, G. J. (Gregory Joseph)
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [2000]
Series:	EEP (Series) ; vol. 28.
Subjects:	Electronic packaging > Congresses. Surface mount technology > Congresses. Solder and soldering > Congresses. Semiconductor wafers > Design and manufacture > Congresses. Photonics > Congresses.

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