Application of micro-heat pipes for the thermal control of semiconductor devices /
Electronic components produce heat that hinders their performance and reliability. Heat pipes, two-phase heat transfer devices, may be used to effectively cool electronic components. This project focuses on two different heat pipe designs that may potentially be used to cool electronic components....
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| Format: | Thesis Book |
| Language: | English |
| Published: |
[Place of publication not identified] :
[publisher not identified] ;
2000.
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| Subjects: | |
| Online Access: | Link to OAK Trust copy |
Internet
Link to OAK Trust copyRemote Storage
| Call Number: |
2000 Fellows Thesis C681 |
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| Notes: |
Cushing Archival Copy (Library Use Only) |
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| Call Number | Status | Get It |
| 2000 Fellows Thesis C681 | Available | |
Available Online
| Call Number: |
2000 Fellows Thesis C681 |
|
|---|---|---|
| Call Number | Status | Get It |
| 2000 Fellows Thesis C681 | Available | |