Application of micro-heat pipes for the thermal control of semiconductor devices /

Electronic components produce heat that hinders their performance and reliability. Heat pipes, two-phase heat transfer devices, may be used to effectively cool electronic components. This project focuses on two different heat pipe designs that may potentially be used to cool electronic components....

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Bibliographic Details
Main Author: Corbett, Brian Patrick
Format: Thesis Book
Language:English
Published: [Place of publication not identified] : [publisher not identified] ; 2000.
Subjects:
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Call Number: 2000 Fellows Thesis C681
Notes: Cushing Archival Copy (Library Use Only)
 
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2000 Fellows Thesis C681 Available

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Call Number: 2000 Fellows Thesis C681
 
Call Number Status Get It
2000 Fellows Thesis C681 Available