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ITherm 2000 : the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000 /

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Bibliographic Details
Corporate Authors: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Las Vegas, Nev., Components, Packaging & Manufacturing Technology Society
Other Authors: Culham, J. Richard, Kromann, Gary B., Ramakrishna, Koneru
Format: Conference Proceeding Book
Language:English
Published: Piscataway, New Jersey : IEEE, [2000]
Subjects:
Electronic apparatus and appliances > Thermal properties > Congresses.
Heat sinks (Electronics) > Congresses.
Ball grid array technology > Congresses.

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Call Number: TK7870.25 .I56 2000
Library Owns: TK7870.25 .I56 2000 (v.1-v.2)
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TK7870.25 .I56 2000 v.1 Available
TK7870.25 .I56 2000 v.2 Available