Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Bibliographic Details
Main Author:	Lau, John H.
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, 2000.
Series:	McGraw-Hill professional engineering.
Subjects:	Multichip modules (Microelectronics) > Design and construction. Microelectronic packaging.

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