Adhesion improvement of electroless copper depositions on titanium nitride by low temperature annealing /

Due to the ever decreasing dimensions of the inter-level metallic interconnects, alternative metal deposition processes must be explored as the current processes (chemical vapor deposition (CVD) and physical vapor deposition (PVDI) are reaching their limits on coverage and uniformity. One such alter...

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Bibliographic Details

Main Author:	Eiserer, Rex Anthony, 1971-
Format:	Thesis eBook
Language:	English
Published:	[Place of publication not identified] : [publisher not identified] ; 1999.
Subjects:	Major electrical engineering.
Online Access:	Link to OAKTrust copy