Advanced electronic packaging : with emphasis on multichip modules /

Multichip module technology handbook /
by: Garrou, Philip E.
Published: (1998)

Introduction to system-on-package (SOP) : miniaturization of the entire system /
by: Tummala, Rao R., 1942-
Published: (2008)

Introduction to system-on-package (SOP) : miniaturization of the entire system /
by: Tummala, Rao R., 1942-
Published: (2008)

Physical design for multichip modules /
by: Sriram, M. (Mysore), 1966-
Published: (1994)

Hybrid assemblies and multichip modules /
by: Kear, Fred W., 1930-
Published: (1993)

Conceptual design of multichip modules and systems /
by: Sandborn, Peter A., 1959-
Published: (1994)

International Conference and Exhibition on Multichip Modules : [proceedings].

SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide /
by: Li, Suny, 1974-
Published: (2017)

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability /
Published: (1994)

Microvias : for low-cost, high-density interconnects /
by: Lau, John H.
Published: (2001)

Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
Published: (1996)

Microelectronics system interconnections : performance and modeling /
Published: (1993)

Foldable flex and thinned silicon multichip packaging technology /
Published: (2003)

1997 International Symposium on Microelectronics : proceedings : October 14-16, 1997, Pennsylvania Convention Center, Philadelphia, Pennsylvania /
Published: (1997)

1995 International Symposium on Microelectronics : proceedings : 24-26 October, 1995, Los Angeles Convention Center, Los Angeles, California /
Published: (1995)

1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota /
Published: (1996)

1993 International Symposium on Microelectronics : proceedings : 9-11 November, 1993, Dallas Convention Center, Dallas, Texas /
Published: (1993)

Proceedings, 1993 IEEE Multi-Chip Module Conference : MCMC-93 /
Published: (1993)

Thermal management handbook : for electronic assemblies /
by: Sergent, Jerry E.
Published: (1998)

Proceedings : 1996 IEEE Multi-Chip Module Conference, February 6-7, 1996, Santa Cruz, California /
Published: (1996)

Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California /
Published: (1994)

High performance design automation for multi-chip modules and packages /
Published: (1996)

1994 IEEE Multi-Chip Module Conference : MCMC-94, March 15-17, 1994, Santa Cruz, California : proceedings /
Published: (1994)

Proceedings 1999 International Symposium on Microelectronics : October 26-28, 1999, Chicago Hilton & Towers, Chicago, Illinois /
Published: (1999)

Advanced electronic packaging.
Published: (2006)

Proceedings 1998 International Symposium on Microelectronics : 1-4 November 1998, San Diego Convention Center, San Diego, California /
Published: (1998)

Routing in the third dimension : from VLSI chips to MCMs /
by: Sherwani, N. A. (Naveed A.)
Published: (1995)

Chip scale package (CSP) : design, materials, processes, reliability, and applications /
by: Lau, John H.
Published: (1999)

Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 : March 18-20, 1992, Santa Cruz, California /
Published: (1992)

MCM C/Mixed Technologies and Thick Film Sensors : Proceedings of the NATO Advanced Research Worshop on Advances in Multi-Chip Modules (MCM) and High Performance Electronic Materials Islamorada, Florida, U.S.A. May 23-25, 1994 /
by: Jones, W. Kinzy
Published: (1995)

MEMS packaging /
Published: (2004)

Microelectronic packaging and laser processing : 25-26 June 1997, Singapore /
Published: (1997)

Microelectronics interconnection and packaging /
Published: (1980)

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
Published: (1991)

Multichip module technologies and alternatives : the basics /
Published: (1993)

Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989 /
Published: (1989)