Advanced electronic packaging : with emphasis on multichip modules /

Bibliographic Details
Other Authors:	Brown, William D., 1943-
Format:	Book
Language:	English
Published:	New York : IEEE Press, [1999]
Series:	IEEE Press series on microelectronic systems.
Subjects:	Microelectronic packaging. Multichip modules (Microelectronics) > Design and construction.

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