Cover Image

Advanced electronic packaging : with emphasis on multichip modules /

Bibliographic Details
Other Authors: Brown, William D., 1943-
Format: Book
Language:English
Published: New York : IEEE Press, [1999]
Series:IEEE Press series on microelectronic systems.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics) > Design and construction.
Description
Physical Description:xxxii, 791 pages : illustrations ; 26 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0780347005 (alk. paper)