Chip scale package (CSP) : design, materials, processes, reliability, and applications /

Bibliographic Details
Main Author:	Lau, John H.
Other Authors:	Lee, Shi-Wei Ricky
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, [1999]
Series:	Electronic packaging and interconnection series.
Subjects:	Integrated circuits > Design and construction. Microelectronic packaging.

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