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Package electrical modeling, thermal modeling, and processing for GaAs wireless applications /

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Bibliographic Details
Main Author: Monthei, Dean L., 1958-
Format: Book
Language:English
Published: Boston : Kluwer Academic, [1999]
Series:Electronic packaging and interconnects series.
Subjects:
Electronic packaging.
Gallium arsenide semiconductors > Design and construction.
Wireless communication systems > Equipment and supplies.
Description
Physical Description:xi, 234 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0792383648 (alk. paper)