Package electrical modeling, thermal modeling, and processing for GaAs wireless applications /
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Boston :
Kluwer Academic,
[1999]
|
| Series: | Electronic packaging and interconnects series.
|
| Subjects: |
Remote Storage
| Call Number: |
TK7870.15 .M66 1999 |
|
|---|---|---|
| Call Number | Status | Get It |
| TK7870.15 .M66 1999 | Available | |