Bibliographic Details
| Corporate Authors: |
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division,
International Mechanical Engineering Congress and Exposition,
ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures |
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| Other Authors: |
Liu, S. (Sheng), 1963-,
Qian, Zhengfang,
Yeh, Chao-pin |
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| Format: | Conference Proceeding
Book
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| Language: | English |
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| Published: |
New York, N.Y. :
Americal Society of Mechanical Engineers,
[1998]
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| Series: | EEP (Series) ;
vol. 24.
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| Subjects: | |
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