Cost modeling system for the IC packaging industry /

The semiconductor market is experiencing a remarkable growth, causing similar growth patterns for the IC packaging world. Semiconductor companies are building new fabs in an effort to keep up with the demand for their die. With costs for new fabs running $1 billion and up, packaging subcontractors...

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Bibliographic Details

Main Author:	Castillo, Claribel, 1964-
Format:	Thesis Book
Language:	English
Published:	[Place of publication not identified] : [publisher not identified] ; 1998.
Subjects:	Major industrial engineering.
Online Access:	http://proxy.library.tamu.edu/login?url=http://proquest.umi.com/pqdweb?did=737704071&sid=1&Fmt=2&clientId=2945&RQT=309&VName=PQD