Proceedings of the 1997 1st Electronic Packaging Technology Conference /

Bibliographic Details
Corporate Authors:	Electronic Packaging Technology Conference Singapore, Components, Packaging & Manufacturing Technology Society, Institute of Materials Research and Engineering, Institute of Microelectronics, Institute of Electrical and Electronics Engineers
Other Authors:	Tay, Andrew A. O., Lim, Thiam Beng
Format:	Conference Proceeding Book
Language:	English
Published:	[Piscataway, N.J.] : Institute of Electrical and Electronics Engineers, [1997]
Subjects:	Electronic packaging > Congresses. Microelectronics > Congresses.

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