The simulation of thermomechanically induced stress in plastic encapsulated IC packages /

Bibliographic Details
Main Author:	Kelly, Gerard, Dr
Format:	Book
Language:	English
Published:	Boston : Kluwer Academic Publishers, [1999]
Subjects:	Microelectronic packaging. Integrated circuits > Materials > Stress corrosion. Electronic apparatus and appliances > Plastic embedment. Integrated circuits > Materials > Thermomechanical properties.

by Kelly, Gerard
Published 1999

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