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The simulation of thermomechanically induced stress in plastic encapsulated IC packages /

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Bibliographic Details
Main Author: Kelly, Gerard, Dr
Format: Book
Language:English
Published: Boston : Kluwer Academic Publishers, [1999]
Subjects:
Microelectronic packaging.
Integrated circuits > Materials > Stress corrosion.
Electronic apparatus and appliances > Plastic embedment.
Integrated circuits > Materials > Thermomechanical properties.

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Call Number: TK7874 .K413 1999
 
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TK7874 .K413 1999 Available