Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
Published: (1994)

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California /
Published: (1998)

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
Published: (1994)

Proceedings of the 1997 1st Electronic Packaging Technology Conference /
Published: (1997)

Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
Published: (1995)

Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992 /
Published: (1992)

Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Published: (1993)

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A. /
Published: (2007)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2016)

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. /
Published: (1985)

Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /
Published: (1992)

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii /
Published: (1999)

Electronics packaging forum.
Published: (1990)

Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
Published: (1996)

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. /
Published: (1991)

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. /
Published: (1998)

Packaging of electronic systems : a mechanical engineering approach /
by: Dally, James W.
Published: (1990)

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
Published: (1988)

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
Published: (1993)

Electronic and photonics packaging : Multi-Scale Electrical and Mechanical Systems--2006 presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA /
Published: (2007)

Electrical performance of electronic packaging.

New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /
Published: (1990)

Electronic enclosures, housings and packages /
by: Süli, Frank
Published: (2019)

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /
Published: (1997)

Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA /
Published: (2005)

Electronic packaging materials science II : symposium held April 15-18, 1986, Palo Alto, California, U.S.A. /
Published: (1986)

Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A. /
Published: (1989)

Advances in electronic circuit packaging.
Published: (1962)

Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
Published: (1995)

Advances in electronic packaging, 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii /
Published: (2003)

Advances in electronic packaging, 2001 : presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition : July 8-13, 2001, Kauai, Hawaii /
Published: (2001)

Failure modes and mechanisms in electronic packages /
by: Viswanadham, Puligandla
Published: (1998)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2009)

Advances in electronic packaging ; symposium record.
Published: (1967)