Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors:	Suhling, J. C. (Jeffrey C.), Liechti, K. M., Liu, S. (Sheng), 1963-
Format:	Conference Proceeding Book
Language:	English
Published:	New York : American Society of Mechanical Engineers, [1997]
Series:	EEP (Series) ; vol. 22. AMD (Series) ; vol. 226.
Subjects:	Electronic packaging > Congresses. Mechanics, Applied > Congresses.

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