Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors: Suhling, J. C. (Jeffrey C.), Liechti, K. M., Liu, S. (Sheng), 1963-
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, [1997]
Series:EEP (Series) ; vol. 22.
AMD (Series) ; vol. 226.
Subjects:

MARC

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245 0 0 |a Applications of experimental mechanics to electronic packaging--1997-- :  |b presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /  |c sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu. 
264 1 |a New York :  |b American Society of Mechanical Engineers,  |c [1997] 
264 4 |c ©1997 
300 |a vi, 136 pages :  |b illustrations ;  |c 28 cm. 
336 |a text  |b txt  |2 rdacontent 
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490 1 |a EEP;  |v vol. 22 
490 1 |a AMD ;  |v vol. 226 
504 |a Includes bibliographic references and author index. 
650 0 |a Electronic packaging  |v Congresses. 
650 0 |a Mechanics, Applied  |v Congresses. 
700 1 |a Suhling, J. C.  |q (Jeffrey C.) 
700 1 |a Liechti, K. M. 
700 1 |a Liu, S.  |q (Sheng),  |d 1963- 
711 2 |a International Mechanical Engineering Congress and Exposition  |d (1997 :  |c Dallas, Texas) 
710 2 |a American Society of Mechanical Engineers.  |b Electrical and Electronic Packaging Division. 
710 2 |a American Society of Mechanical Engineers.  |b Applied Mechanics Division. 
830 0 |a EEP (Series) ;  |v vol. 22. 
830 0 |a AMD (Series) ;  |v vol. 226. 
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