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Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division
Other Authors: Suhling, J. C. (Jeffrey C.), Liechti, K. M., Liu, S. (Sheng), 1963-
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, [1997]
Series:EEP (Series) ; vol. 22.
AMD (Series) ; vol. 226.
Subjects:
Electronic packaging > Congresses.
Mechanics, Applied > Congresses.
Description
Physical Description:vi, 136 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographic references and author index.
ISBN:0791818500