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Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits.

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Bibliographic Details
Corporate Authors: International Symposium on the Physical & Failure Analysis of Integrated Circuits, Institute of Electrical and Electronics Engineers, IEEE. Singapore Section, IEEE Electron Devices Society
Format: Conference Proceeding
Language:English
Published: Piscataway, N.J. : IEEE Service Center.
Subjects:
Integrated circuits > Design and construction > Congresses.
Integrated circuits > Testing > Congresses.
Microelectronics > Research > Congresses.
Description
Item Description:Description based on: 5th ('95); title from cover.
Physical Description:volumes : illustrations ; 28 cm.