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Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition Dallas, Tex., American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Chen, William T., Read, D. T.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [1997]
Series:AMD (Series) ; vol. 222.
EEP (Series) ; vol. 20.
Subjects:
Electronic packaging > Congresses.
Fracture mechanics > Congresses.
Description
Physical Description:vi, 193 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791818276