Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition Dallas, Tex., American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Chen, William T., Read, D. T.
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1997]
Series:	AMD (Series) ; vol. 222. EEP (Series) ; vol. 20.
Subjects:	Electronic packaging > Congresses. Fracture mechanics > Congresses.

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