Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /

Bibliographic Details
Corporate Authors:	International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai
Other Authors:	Hsu, Tai-Ran, Bar-Cohen, Avram, 1946-, Nakayama, Wataru
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y : American Society of Mechanical Engineers, [1995]
Series:	EEP (Series) ; vol. 10.
Subjects:	Electronic packaging > Congresses.

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