Engineering design automation tool for yield learning model for IC packaging /
a design automation tool has been developed and implemented.
| Main Author: | |
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| Format: | Thesis eBook |
| Language: | English |
| Published: |
[Place of publication not identified] :
[publisher not identified] ;
1996.
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| Subjects: | |
| Online Access: | Link to OAKTrust copy |
Internet
Link to OAKTrust copyCushing: Theses & Dissertations Microforms (Does not check out)
| Call Number: |
1996 Thesis S274 |
|
|---|---|---|
| Call Number | Status | Get It |
| 1996 Thesis S274 | Available | |
Available Online
| Call Number: |
1996 Thesis S274 |
|
|---|---|---|
| Call Number | Status | Get It |
| 1996 Thesis S274 | Available | |