Reliability of electronic packages and semiconductor devices /

Bibliographic Details
Main Author:	Di Giacomo, Giulio
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, [1997]
Series:	Electronic packaging and interconnection series.
Subjects:	Semiconductors > Reliability. Microelectronic packaging > Reliability.

Description
Physical Description:	xiv, 410 pages : illustrations ; 24 cm.
Bibliography:	Includes bibliographical references and index.
ISBN:	007017024X (hc)