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Reliability of electronic packages and semiconductor devices /

Bibliographic Details
Main Author: Di Giacomo, Giulio
Format: Book
Language:English
Published: New York : McGraw-Hill, [1997]
Series:Electronic packaging and interconnection series.
Subjects:
Semiconductors > Reliability.
Microelectronic packaging > Reliability.

Remote Storage

Holdings details from Remote Storage
Call Number: TK7871.85 .D4957 1997
 
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TK7871.85 .D4957 1997 Available