Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /

Bibliographic Details
Corporate Authors:	International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Ume, Charles, Yeh, Chao-pin
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1996]
Series:	EEP (Series) ; vol. 17.
Subjects:	Electronic packaging > Congresses. Multichip modules (Microelectronics) > Congresses.

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