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Proceedings /

Bibliographic Details
Previous Title:International Conference on Wafer Scale Integration. Proceedings
Corporate Authors: International Conference on Innovative Systems in Silicon, IEEE Computer Society, Components, Packaging & Manufacturing Technology Society
Format: Conference Proceeding
Language:English
Published: [New York, N.Y.] : Institute of Electrical and Electronics Engineers, [1996-]
Subjects:
Integrated circuits > Wafer-scale integration > Congresses.
Integrated circuits > Very large scale integration > Congresses.
Semiconductors > Congresses.
Online Availability: Check for online availability
Description
Published:8th (1996)-
Physical Description:volumes : illustrations ; 23 cm.
Publication Frequency:Annual
ISSN:1094-7116
1063-2204