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Proceedings /

Bibliographic Details
Previous Title:International Conference on Wafer Scale Integration. Proceedings
Corporate Authors: International Conference on Innovative Systems in Silicon, IEEE Computer Society, Components, Packaging & Manufacturing Technology Society
Format: Conference Proceeding
Language:English
Published: [New York, N.Y.] : Institute of Electrical and Electronics Engineers, [1996-]
Subjects:
Integrated circuits > Wafer-scale integration > Congresses.
Integrated circuits > Very large scale integration > Congresses.
Semiconductors > Congresses.
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Remote Storage

Holdings details from Remote Storage
Call Number: TK7874 .I578
Notes: Subscription converted to electronic format.
Library Owns: TK7874 .I578 (8th (1996); 1997)
Call Number Status Get It
TK7874 .I578 1997 Available
TK7874 .I578 8th 1996 Available