Cover Image

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
Other Authors: Agonafer, D., Fulton, Robert E.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [1994]
Series:EEP (Series) ; vol. 9.
Subjects:
Heat sinks (Electronics) > Congresses.
Electronic packaging > Congresses.
Heat sinks (Electronics)
Electronic packaging.
Description
Physical Description:v, 89 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791814602 (pbk.) :