CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
Other Authors:	Agonafer, D., Fulton, Robert E.
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [1994]
Series:	EEP (Series) ; vol. 9.
Subjects:	Heat sinks (Electronics) > Congresses. Electronic packaging > Congresses. Heat sinks (Electronics) Electronic packaging.

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